Igurishwa Rishyushye HDI Multilayer FR4 PCB Ikibaho Cyumurongo wa Micro SD Ikarita
Ibisobanuro Byihuse:
Ubunini bw'umuringa: 1 oz
Ubunini bwinama: 1.0mm
Min.Ingano ya Hole: 0,20mm
Min.Ubugari bwumurongo: 0.075mm
Min.Umwanya Umurongo: 0.075mm
Kurangiza Ubuso: ENIG
Ingano yubuyobozi: Yashizweho
Ibicuruzwa bya Solder Ibara: Icyatsi kibisi
Ubworoherane bw'Inama y'Ubutegetsi: +/- 10%
Inguni ya V yaciwe: 25 °, 30 °, 45 °, 60 °
Kugoreka & Gupfunyika: ≤ 0.5%
Dosiye: Pro tel 99se / P-CAD / Imodoka cad / Cam350
Gupakira imbere: Gupakira Vacuum, Umufuka wa plastiki
Gupakira hanze: Gupakira bisanzwe
Serivisi: PCB & PCBA
Igice: 6
Mask ya silike: Yera
Ibisobanuro
1 | Ibisobanuro | Ibisobanuro bya PCB |
2 | Ibikoresho | FR-4 / HTG150-180 FR-4 / CEM-1 / CEM-3 / Aluminium |
3 | Inzira | 1-20 |
4 | Ubunini bwinama | 0.2mm- 4.0mm |
5 | Ubworoherane bw'Inama y'Ubutegetsi | +/- 10% |
6 | Ubunini bw'umuringa | 17.5um-175um (0.5oz-5oz) |
7 | Ubugari bwa Min | 0.15mm |
8 | Umwanya muto | 0.15mm |
9 | Gucukura Min | 0.2mm |
10 | Ubunini bw'umuringa | 0.4-2mil (10-50um) |
11 | Ubworoherane bwa Etching | M 1mil (± 25um) |
12 | V-gukata inguni | 25 °, 30 °, 45 °, 60 ° |
13 | Isaro Imbaraga zumurongo | ≥ 6lb / muri (≥ 107g / mm) |
14 | Kugenzura no kwihanganira | 50Ω ± 10% |
15 | Kugoreka & Gupfunyika | ≤ 0.5% |
16 | Mask | Icyatsi, Umutuku, Ubururu, Umweru, Umukara, Umuhondo |
17 | Ubuso Kurangiza / Gushiraho | HASL / Kuyobora Ubuntu HASL / OSP / Gufata Zahabu / Immersion Zahabu / ENIG |
18 | Icyemezo | ROSH.ISO9001 |
19 | Idosiye | Protel 99se / P-CAD / Imodoka idasanzwe / Kam350 |
20 | Gupakira imbere | Gupakira icyuho, igikapu cya plastiki |
21 | Gupakira hanze | Gupakira amakarito asanzwe |
Uruganda rwacu:
Andika ubutumwa bwawe hano hanyuma utwohereze